Semiconductor Fabrication Services
Semiconductor fabrication services for end-to-end microfabrication and process development, supporting research institutions, startups, and advanced engineering teams. Our capabilities include lithography, thin film deposition, etching, doping, and device integration, enabling rapid prototyping and precise control over complex device structures.
Core fabrication services
Microfabrication & Lithography
Patterning for micro- and nano-scale device fabrication.
- UV photolithography
- E-beam lithography
- Multi-layer alignment
Thin Film Deposition
Advanced thin film engineering for electronic and optical devices.
- PVD (sputtering, evaporation)
- CVD / PECVD
- Custom film stacks
Etching & Surface Processing
High-precision material removal and structure definition.
- RIE / ICP / DRIE
- Wet etching
- CMP & finishing
Doping & Ion Implantation
Controlled doping processes enabling semiconductor functionality.
- Ion implantation
- Si / SiC doping
- Annealing
MEMS / Microfluidics
Fast-turnaround MEMS/Microfluidics fabrication and rapid prototyping.
- MEMS device fabrication
- Microfluidic channel structures
- Custom device development
Dicing & Device Integration
Final-stage to prepare fabricated devices for testing, integration, and application deployment.
- Wafer dicing & die separation
- Device packaging
- Integration
- Prototype assembly support
Custom process development
Tailored to your device requirements
We support custom process development for research labs, national laboratories, and deep-tech startups — from process flow design through engineering collaboration.
What we offer
- Process flow design
- Multi-step integration
- Iterative prototyping
- Engineering collaboration
Ideal for
- Research laboratories
- National laboratories
- Deep-tech startups
- University R&D groups
Ready to start your project?
Talk to an engineer about your process requirements, material platform, and device goals.