Semiconductor Etching Services
Our semiconductor etching services deliver high-precision dry and wet etching solutions for MEMS, microfabrication, and advanced materials. We support key processes including RIE, ICP, and DRIE, enabling both anisotropic and isotropic etching with excellent uniformity, selectivity, and profile control. From pattern transfer to surface planarization, our etching and surface processing capabilities are tailored to meet application-specific requirements across research, prototyping, and low-volume production. We work with a wide range of materials including silicon, SiO₂, Si₃N₄, quartz, and compound semiconductors.
Etching methods
01
Dry Etching
Plasma-based etching for precise, anisotropic material removal and high aspect ratio structure definition.
- Reactive Ion Etching (RIE)
- Inductively Coupled Plasma (ICP)
- Deep Reactive Ion Etching (DRIE)
- High aspect ratio structures
02
Wet Etching
Chemical etching processes for isotropic and selective material removal across a wide range of substrates.
- Isotropic & anisotropic etching
- Acid and alkaline processes
- Selective material removal
- Cost-effective batch processing
Materials & applications
Supported materials
Typical applications
- MEMS fabrication
- Microfluidic device patterning
- Semiconductor processing
- Surface preparation for thin film deposition
- Micro- and nano-structure definition
- Photonic & waveguide etching
Process specifications
Key process parameters
| Parameter | Specification | Notes |
|---|---|---|
| Dry etch methods | RIE, ICP, DRIE (Bosch & cryogenic) | Material & structure dependent |
| Aspect ratio (DRIE) | Up to 30:1+ | Si & SiC substrates |
| Wet etch chemistry | HF, KOH, H₃PO₄, BOE, and custom | Isotropic & anisotropic options |
| Etch selectivity | High — material dependent | Mask options: photoresist, SiO₂, metal |
| Surface roughness (CMP) | Ra < 1 nm achievable | Material & process dependent |
| Wafer size | Up to 6 inches (150 mm) | Smaller sizes supported |
| Supported materials | Si, SiO₂, SiNₓ, metals, GaN, SiC, glass | Custom on request |
Need precision etching or surface processing?
Tell us your material, target etch depth, and application — our team will identify the right process and respond within 48 hours.