Semiconductor Device Packaging

Lab-scale packaging solutions for die handling, chip mounting, basic electrical interconnect, and encapsulation of prototype and research devices. We support packaging workflows that bridge the gap between singulated die and functional evaluation, helping prepare custom chips for testing, system validation, and early-stage demonstration. Packaging routes are selected according to die size, substrate type, interconnect needs, and the performance requirements of the final prototype.

Chip mounting Basic interconnect Wire bonding support Encapsulation options Prototype packaging

Key capabilities

Chip mounting and handling

Die can be prepared and mounted for packaging, testing, or further assembly steps in small-lot and prototype environments.

Chip mounting and handling
Die attachment preparation
Support for singulated die
Prototype-scale packaging routes

Electrical interconnect support

Packaging workflows can include basic interconnect schemes for lab validation and early-stage electrical evaluation.

Wire bonding / basic interconnect
Pad-access aware mounting strategy
Support for electrical testing access
Package-to-test readiness preparation

Encapsulation and protection

Protective packaging routes may be used when the prototype needs handling stability, transportability, or basic environmental shielding.

Encapsulation options
Handling protection
Lab-scale packaging solutions
Application-aware packaging review

Workflow

How device packaging projects are typically prepared

Review die format and test objective

Packaging begins with understanding the die size, pad layout, fragility, and whether the end goal is handling, electrical measurement, environmental protection, or demonstration-level integration.

Select mounting and interconnect route

The package format, die attachment method, and electrical connection approach are chosen according to prototype constraints, available contact pads, and downstream testing requirements.

Protect and stabilize the device

Where needed, encapsulation or protection steps can be incorporated to improve handling robustness or maintain functionality during transport and evaluation.

Prepare for testing or assembly

The packaged device is then positioned for electrical testing, system integration, or continued development in a more application-relevant format than bare die alone.

Technical considerations

Key parameters for device packaging

Parameter	Typical consideration	Engineering note
Die format	Loose die, singulated chips, or small-lot packaged outputs	Input condition affects the packaging route
Interconnect need	Basic electrical access, pad connection, or prototype signal routing	Must match the testing objective
Package style	Lab-scale, custom, or application-driven prototype package	Package choice depends on validation and use environment
Encapsulation level	None, partial protection, or more complete prototype encapsulation	Should reflect handling and environmental needs
Device fragility	Mechanical sensitivity, pad vulnerability, and edge integrity	Important for small and brittle die
Testing compatibility	Bench-top measurement, socket-style use, or custom fixture integration	Package should support the actual validation route
Project scale	Prototype and R&D packaging rather than mass production	Best suited to custom and research workflows

Typical packaging elements

Chip mounting Die handling Wire bonding Basic interconnect Encapsulation Prototype package formats

Typical applications

Prototype electronics

Packaging research chips for bench testing and proof-of-concept validation.

Sensor devices

Preparing sensor die for connection, protection, and experimental evaluation.

MEMS and microdevices

Handling and packaging fragile structures for test access and functional demonstration.

Custom R&D programs

Lab-scale packaging routes for non-standard chips and early-stage device concepts.

Engineering considerations

Device packaging for research and prototype programs is rarely just a mechanical container. It is often the first step that makes a custom die testable, connectable, and robust enough for meaningful evaluation. The best packaging route is the one that supports the actual measurement and integration goals of the project.

Need packaging for a prototype device?

Tell us your die format, interconnect needs, and test objective. We can help define a practical lab-scale packaging route for your program.

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