Semiconductor Integration & Assembly
Our semiconductor assembly services support device integration, packaging preparation, and system-level assembly for MEMS, photonic, and custom semiconductor devices. We help transition fabricated chips into functional systems ready for testing, validation, and application deployment. From die handling and mounting to interconnect preparation and integration, our services are designed for research, prototyping, and low-volume production. We focus on precision, reliability, and flexibility to meet the needs of advanced device development.
Key capabilities
01
Prototype assembly
Prototype hardware can be assembled into a more application-relevant form for evaluation and demonstration.
- Prototype assembly
- Small-lot engineering builds
- Support for custom component combinations
- Preparation for validation workflows
02
Multi-component integration
Devices often need to be integrated with holders, connectors, electronics, optics, or sensor subsystems before meaningful testing can begin.
- Multi-component integration
- Subassembly preparation
- Custom fixture and interface awareness
- Support for cross-disciplinary device projects
03
Test-ready system connection
Assembly routes can be designed so the prototype is easier to connect, handle, and evaluate in a real laboratory or application environment.
- Device-to-system connection
- Test-ready device preparation
- Improved handling for validation setups
- Application deployment support at prototype level
Workflow
How integration and assembly projects are typically structured
Define the device and system interface
The project starts by understanding what the device is, how it needs to connect mechanically or electrically, and what environment it must operate in during validation.
Identify the supporting components
Many prototypes require additional pieces such as carriers, housings, connectors, holders, cables, or support electronics before they can be tested effectively.
Assemble for handling and evaluation
The device and related components are assembled into a format that improves handling, test access, alignment, and basic system-level usability.
Prepare for validation or deployment
The final integrated unit is organized around the intended validation route, whether that means lab measurement, subsystem demonstration, or early application deployment testing.
Technical considerations
Key parameters for integration and assembly
| Parameter | Typical consideration | Engineering note |
|---|---|---|
| Device format | Bare die, packaged chip, module, or custom component | Defines the required assembly approach |
| Connection type | Electrical, mechanical, optical, fluidic, or mixed interface | Assembly must match the real use case |
| Support hardware | Mounts, holders, connectors, fixtures, or subassemblies | Often necessary before testing can begin |
| Validation route | Bench-top evaluation, subsystem test, or prototype deployment | Should drive the integration format |
| Component count | Single-device to multi-part prototype assemblies | Complexity affects build and handling strategy |
| Fragility and handling | Sensitive devices may need protective support structures | Important for optics, MEMS, and custom sensor hardware |
| Project scale | Prototype and engineering build support | Focused on custom and lab-scale work, not mass assembly |
Typical integration elements
Typical applications
Sensor systems
Integrating packaged or mounted sensors into usable prototype test formats.
Optoelectronic devices
Building application-oriented assemblies that connect custom devices to test setups and supporting hardware.
MEMS prototypes
Supporting fragile microdevice handling, interface hardware, and early-stage system validation.
Custom R&D hardware
Helping convert individual parts into coherent prototype systems for internal development or customer evaluation.
Engineering considerations
Integration and assembly are often where a custom device either becomes usable or remains only a lab artifact. Even simple prototype hardware benefits from an intentional assembly strategy that accounts for interfaces, handling, connection reliability, and the actual environment where the device will be evaluated.
Need help turning devices into usable prototypes?
Tell us what components you have and how the final system needs to function. We can help define a practical integration and assembly route for your project.