Sputtering
Deposition
Services
High-vacuum sputtering deposition for dense, uniform metal, dielectric, and compound thin films. Our sputtering process supports adhesion layers, conductive coatings, barrier films, optical layers, and multilayer stacks for semiconductor research and prototype device fabrication.
Request a QuotePrecision Thin Film
Deposition
DR Research Foundry provides sputtering deposition services for semiconductor research, MEMS fabrication, photonic device development, and advanced materials R&D. Sputtering is well suited for dense, uniform thin films with strong adhesion and good step coverage across patterned substrates.
Sputtering is a physical vapor deposition (PVD) process in which energetic ions from a plasma bombard a solid target material. Atoms are ejected from the target and deposited onto the substrate surface to form a controlled thin film. Compared with evaporation, sputtering can provide improved film density, adhesion, and coverage on non-planar features.
Our process supports metal films, adhesion layers, barrier layers, transparent conductive coatings, dielectric films, and multilayer stacks for research and prototype devices.
| Base Pressure | ≤ 1 × 10⁻⁷ Torr |
| Sputtering Modes | DC / RF sputtering |
| Film Uniformity | < ±3% across 4" wafer |
| Film Thickness Range | 5 nm – 2 µm |
| Substrate Size | Coupons to 4" wafers |
| Process Gas | Ar, O₂, N₂ available by request |
| Substrate Rotation | Yes — planetary rotation |
| Target Materials | Metals, oxides, nitrides, compounds |
From Substrate to Film — Our Process
Metals, Alloys & Dielectrics
Deposition Parameters
| Parameter | Specification | Notes |
|---|---|---|
| Base Pressure | ≤ 1 × 10⁻⁷ Torr | High-vacuum chamber for reduced contamination |
| Sputtering Modes | DC / RF | DC for conductive targets; RF for insulating or dielectric targets |
| Process Gas | Ar, O₂, N₂ | Reactive sputtering available depending on material and target |
| Film Thickness | 5 nm – 2,000 nm | Measured by profilometry or ellipsometry |
| Film Uniformity | < ±3% across 4" wafer | Substrate rotation improves uniformity |
| Substrate Size | Coupons – 4" wafers | Custom fixturing available for small or irregular samples |
| Substrate Temperature | RT – 300 °C | Heated substrate deposition available by request |
| Multilayer Deposition | Yes | Sequential metal / dielectric / barrier stacks available |
| Pattern Compatibility | Blanket / Shadow Mask / Lift-Off | Lift-off feasibility depends on film thickness and sidewall profile |
Device Platforms We Support
Dense, Uniform Films
with Strong Adhesion
Sputtering is preferred when thin films require high density, strong adhesion, good uniformity, and improved coverage over patterned or non-planar substrates. It is widely used for semiconductor metallization, diffusion barriers, transparent conductive films, optical coatings, and compound material deposition.
Compared with evaporation, sputtering can provide better film adhesion and step coverage, making it suitable for device structures that require reliable electrical, optical, or mechanical performance across complex surface topography.
Flexible Engagement
for R&D Teams
DR Research Foundry works directly with principal investigators, device engineers, and program managers to develop deposition recipes tailored to your specific device requirements. We offer both standard and custom process flows, with full in-house metrology to verify film quality before shipment.
Our team supports single-run prototype depositions, iterative process development campaigns, and small-volume production runs. Process documentation, deposition logs, and characterization data are provided with every order to support publication and process transfer requirements.
Need Sputtering Deposition
for Your Thin Film Stack?
Send us your target material, film thickness, substrate, patterning method, and application requirements. Our engineering team will review feasibility and provide a detailed quotation.
Contact Our Team