E-Beam
Evaporation
Services
High-vacuum electron-beam evaporation for precise metal, dielectric, and refractory thin film deposition. E-beam source heating enables high-purity coatings, controlled deposition rates, and excellent film quality for semiconductor research and prototype device fabrication.
Request a QuoteE-beam Evaporation System
Precision Thin Film
Deposition
DR Research Foundry provides e-beam evaporation deposition services for semiconductor research, MEMS fabrication, photonic device development, and advanced materials R&D. Electron-beam evaporation enables high-purity thin film deposition of metals, oxides, and refractory materials that are difficult to deposit by standard thermal evaporation.
E-beam evaporation is a physical vapor deposition (PVD) process in which a focused electron beam locally heats the source material under high vacuum. The evaporated material condenses onto the substrate surface to form a controlled thin film with excellent purity, low contamination, and sharp interfaces.
Our process supports single-layer and multi-layer film stacks, adhesion layers, contact metallization, optical coatings, and lift-off-compatible deposition for research and prototype devices.
| Base Pressure | ≤ 1 × 10⁻⁷ Torr |
| Deposition Rate | 0.1 – 10 Å/s (controllable) |
| Thickness Uniformity | < ±3% across 4" wafer |
| Film Thickness Range | 5 nm – 2 µm |
| Substrate Size | Coupons to 4" wafers |
| Rate Monitor | In-situ QCM |
| Substrate Rotation | Yes — planetary rotation |
| Source Configuration | Electron-Beam Crucible Source |
From Substrate to Film — Our Process
Metals, Alloys & Dielectrics
Deposition Parameters
| Parameter | Specification | Notes |
|---|---|---|
| Base Pressure | ≤ 1 × 10⁻⁷ Torr | Turbomolecular + roughing pump combination |
| Deposition Rate | 0.1 – 10 Å/s | Programmable ramp; QCM closed-loop or open-loop control |
| Film Thickness | 5 nm – 2,000 nm | Verified by profilometry or ellipsometry post-deposition |
| Thickness Uniformity | < ±3% (4" wafer) | Enabled by planetary substrate rotation |
| Substrate Size | Coupons – 4" wafers | Custom fixturing for non-standard substrates available |
| Substrate Temperature | RT – 300 °C | Heated stage available on request |
| Multi-Layer Deposition | Yes (sequential) | Bilayer and trilayer stacks without breaking vacuum |
| Source Purity | ≥ 99.99% (4N) | 5N sources available on request |
| Lift-Off Compatible | Yes | Optimized for PMMA and LOR bilayer resist systems |
Device Platforms We Support
The Right Process
for Your Application
E-beam evaporation is widely used for depositing high-purity metals, refractory materials, and optical thin films that are difficult to process using conventional thermal evaporation. The localized electron-beam heating minimizes contamination while enabling stable deposition of high-melting-point materials.
The directional vapor flux and high-vacuum environment make e-beam evaporation highly suitable for lift-off lithography, optical coatings, semiconductor metallization, and multilayer thin film stacks requiring sharp interfaces and precise thickness control.
Flexible Engagement
for R&D Teams
DR Research Foundry works directly with principal investigators, device engineers, and program managers to develop deposition recipes tailored to your specific device requirements. We offer both standard and custom process flows, with full in-house metrology to verify film quality before shipment.
Our team supports single-run prototype depositions, iterative process development campaigns, and small-volume production runs. Process documentation, deposition logs, and characterization data are provided with every order to support publication and process transfer requirements.
Ready to Discuss Your
Deposition Requirements?
Submit your process requirements and our engineering team will respond with a detailed technical assessment and project quote within 2 business days.
Contact Our Team